Key Points:
- Xiaomi Civi 3 is the upcoming phone of the company the same will be official in the near future.
- The device is confirmed to come with a custom Dimensity 8200 Ultra SoC.
- There is no information on the launching date.
Xiaomi is believed to launch the new Xiaomi Civi 3 smartphone in the near future and the company recently confirmed that it has collaborated with Disney for a special variant of the device as well. Now the chipset information of the device is officially confirmed. So let’s get into the article to check out the new information.
It is officially confirmed that the upcoming Xiaomi Civi 3 will be coming with a custom Dimensity 8200 mobile processor at its heart and it is supporting 5G speeds up to 17 Gbps along with Wi-Fi 6E and Bluetooth 5.3.
It is expected to feature a 6.55-inch OLED display with curved edges and it is expected to feature a dual setup of 32-megapixel selfie cameras. The back panel of the device will feature the Sony IMX800-series.
The upcoming device is also expected to come with up to 12 GB of RAM and a generous 512 GB of internal storage. It is also rumored to support 67W fast charging.
So let’s wait for the launching of the device and we recommend you to stay tuned with us for more updates from the world of technology.
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