The Xiaomi Mix Flip is one of the upcoming folding devices of the brand and today the schematic leaked that reveals the design language of the device. So let’s get into the article to check out the new piece of information.
It is confirming that the device will be coming with a massive cover display on the board. It also features dual rings with the first one featuring an LED flash and a camera while the second ring is housing the second rear facing camera. It will also feature an external earpiece and that will enhance the functionality.
The upcoming device is expected to come with the power of the Snapdragon 8 Gen 3 mobile processor at its heart along with AI capabilities. The device will be supporting a 67W fast charging solution and it will come with a 50 megapixel primary sensor.
So let’s wait for the launch of the device and you guys are recommended to stick with us for more updates from the world of technology.
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