It is expected that the upcoming Realme 11 Pro 5G smartphone is around the corner as the device is passing through important certification platforms. Now the device has passed the TENAA certification with model number “RMX3770” in China. The listing is revealing some important information about the upcoming smartphone.
Going through the renders, we can see the upcoming Realme 11 Pro 5G features a punch-hole setup at the centre position of the screen and it is having a curved screen.
The back panel of the device is having a circular camera module with the primary camera sensor and the same is at the centre position. The camera module is also having two secondary lenses on either side and an LED flash above them. The back panel of the device is also having the logo of the brand.
Separately, Digital Chat Station has reported that the upcoming Realme 11 Pro 5G will be coming with the MediaTek Dimensity chipset with 5G and is likely to launch in May 2023.
The device is already passed through the TKDN and Bluetooth SIG certifications. So let’s wait for the launching of the device and we recommend you to stay tuned with us for more updates from the world of technology.
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