Samsung is focusing on chipset very seriously and now we got the important details about the next generation Samsung Exynos 2700, which surfaced online and the same will be launched next year. The latest leak reveals major upgrades in performance, efficiency & thermal design. So let’s get into the article to check out the full details.
Leaked specifications of Exynos 2700
According to the latest information from tipster Kaulenda, the next generation Exynos 2700 will be built on Samsung Foundry’s second-generation 2nm process, known as SF2P.
It is utilising a refined Gate-All-Around (GAA) architecture, and the same is believed to provide a 12% performance boost along with a massive 25% reduction in power consumption compared to the upcoming SF2-based Exynos 2600 processor.
The upcoming Exynos 2700 is expected to feature ARM’s next-generation C2 cores, likely labeled as C2-Ultra and C2-Pro. The processor is also expected to bring FOWLP-SbS (Side-by-Side) packaging and this will be offering the die and DRAM horizontally under a unified copper-based Heat Path Block to enhance thermals.
It is tipped to offer a next-gen AMD-based Xclipse GPU with LPDDR6 memory (supporting up to 14.4 Gbps) and UFS 5.0 storage. Samsung is expected to use the new chipset in the next generation Samsung Galaxy S27 series and we need to wait for more details about the processor in the coming months.
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