It is reported that HMD’s next modular smartphone will be launched soon as today we got some important information about the upcoming HMD Fusion 2. So let’s get into the article to check out the new piece of information.
According to a leak shared by HMD Meme, the upcoming HMD Fusion 2 will be coming with upgrades to both its display and processor compared to the previous model.
It is reported that the upcoming device will feature a 6.58-inch Full HD+ display with a 120Hz refresh rate. The device will be coming with the power of the newly announced Qualcomm Snapdragon 6s Gen 4 mobile processor.
The device is also reported to feature a 108MP main sensor along with an 8MP ultra-wide camera. The device is also expected to come with IP65 water and dust resistance along with connectivity options like NFC, Bluetooth 5.3, and a 3.5mm headphone jack. The device will be coming with two-way magnetic pins on the back and the same will enable you to attach different cases.
It is expected that the company will be bringing a Wireless Charge Outfit, Gaming Outfit, Camera Grip Outfit, Speaker Outfit, and even a Smart Projector Outfit. The device will also come with a Casual Outfit with a Kickstand, a Rugged Outfit, and a Flashy Outfit.
The company will also enable users 3D print their own custom designs using the open-source Fusion Development Toolkit. We don’t have any information about the launch date of the device at the moment of time but we are looking forward to hear more about the same in the coming days. You guys are recommended to stick with us for more updates at your fingertips.
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