Honor Magic 3 Teased And Revealed Key Features

Key Points:

• The company has confirmed the details about the front and cooling setup
• It will be powered by the latest and greatest Snapdragon 888 Plus processor
• The device will run on Android 11 out of the box
  

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Honor Magic 3 is the upcoming flagship smartphone of the Chinese brand and it will be announced on August 12 alongside its upcoming flagship tablet. The company has shared a new teaser video today and that reveals some important specifications. So without making any further delay let’s dive into the article to check out all the available information about the upcoming smartphone. 

Going through the teaser video, we can see that the Honor Magic 3 will feature a dual punch-hole setup and that means the device will feature a dual front facing camera. In the video, the company has also confirmed that the upcoming smartphone will have improved cooling technology and that means users can able to have an amazing experience while gaming. 

The upcoming device will be powered by the latest and greatest Qualcomm Snapdragon 888 Plus mobile processor and it will have 8GB of RAM but we believe that there will be a couple of more variants. It will run on Android 11 out of the box and the device will feature 5 cameras setup on the back and that will have a 64 megapixel primary sensory. 

So let’s wait for the official announcement of the upcoming Honor Magic 3 and we recommend you to stay tuned with us for more interesting information from the technological world at your fingertips.

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