The Chinese telecommunication giant Huawei has unveiled the new Kirin 990 processor at the ongoing IFA 2019 event, and the processor is coming in two variants – 4G and 5G. The new processor will cut down the cost of production for the next generation Communication Technology as the new chipset coming with built-in 5G modem.
The Kirin 990 5G is based on TSMC’s 7FF+ with EUV, and it will make the chip to have a smaller die size, and possibly making it Huawei’s largest smartphone SoC till date. The new chipset is also capable to provide a maximum download speed of 2.3 Gbps, and a maximum upload speed of 1.25 Gbps. It is also powered with MLbeamforming technology and that offer faster speeds during high-speed travel.
It also features ‘SmartCache’ which will support the GPU along with helping the CPU and NPU as well. The Kirin 990 has a 16-core Mali-G76 GPU. For the Neural Processing Unit (NPU), the company has added in-house Da Vinci architecture. The new chipset is expected to power the smartphones of the company in next year.
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