Xiaomi has already confirmed the launching date of the Xiaomi Mix Fold 4 and Xiaomi Smart Band 9 for the market of China and the same will be official on July 19. The company is making the event larger as the company has confirmed the launch date of yet another product and that is the Redmi K70 Ultra. So let’s get into the article to check out the launch date of the device and other details.
The upcoming Redmi K70 Ultra is confirmed to be announced during the coming July 19 launching event. The device will be coming with the MediaTek Dimensity 9300+ processor along with the Surge P2 for fast charging, the G1 for power management, the T1 for signal enhancement, and the D1 for independent display processing.
The upcoming Redmi K70 Ultra smartphone is confirmed to come with a large 5500 mAh battery along with 120W fast charging, and the upcoming device will feature the Pengpai T1 signal enhancement chip.
It is also confirmed that the upcoming Redmi K70 Ultra smartphone will be coming with 24 GB of RAM on the board and 1TB of internal storage. It is confirmed that the upcoming Redmi K70 Ultra smartphone will be coming with 1.7mm bezel and the same looks narrower than the previous generation. The bottom bezel of the smartphone is slightly thicker and the same is measured at 1.9mm and the bottom bezel is reportedly the narrowest in the brand’s history.
The device is said to achieve an AnTuTu score of 2,382,780 points and it is confirmed to come with a new generation of 3D ice cooling technology, and the same uses an innovative concave-convex platform design. The convex surface is said to be closer to the mobile processor of the device and the same can reduce the SoC core temperature by up to 3°C compared to the Redmi K60 Ultra. This technology is also said to be powerful enough to reduce the temperature of display.
So let’s wait for the launch of the device and you guys are recommended to stick with us for more updates from the world of technology.
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