The Chinese electronics giant Xiaomi is currently working on its upcoming processor and the same will be dubbed the XRING O3, and it is expected to power the upcoming Xiaomi 17 Fold. Today the important details of the upcoming processor appear online. So let’s get into the article to check out the details.
According to the latest information, the upcoming XRING O3 is under development under the codename “lhasa.” The upcoming processor features a four-cluster, 10-core layout, and it is expected to drop the extra “big” core cluster altogether and is said to feature an octa-core design.
The upcoming processor is said to feature a combination of Prime, Titanium, and Little cores. It is expected that the Prime core could exceed the 4GHz mark, reaching up to 4.05GHz, while the Titanium cores, designed for high-performance tasks, may run at 3.42GHz.
It is expected to come with the GPU which will be offering 1.5GHz and the memory speed might remain unchanged at 9600 MT/s. So let’s wait for more details about the processor and you guys are recommended to stick with us for more updates at your fingertips.
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