Honor Magic Flip is one of the upcoming devices of the brand and the same will feature if flip folding design. Today the launch timeline and design language of the device appears online. So without making any further delay let’s get into the article to check out the full details.
It is reported that the Chinese smartphone brand is planning to launch the Honor Magic Flip in China spring festival and the same takes place between February 10 and February 17.
The upcoming device is also said to feature two circular rings module. The top module is expected to house the camera sensors while the lower one is expected to feature the external cover display.
So let’s wait for the launch of the device and you guys are recommended to stick with us for more updates from the world of technology.
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