The popular mobile chipset maker MediaTek has unveiled 3 new chips – MediaTek Dimensity 8100, Dimensity 8000, Dimensity 1300 and the same coming with the impressive specifications and the chipsets will be available on the devices later this year. The newly announced chips have capabilities including 200 megapixel camera sensor and more. So let’s get into the article to check out the complete details of the newly announced mobile chipsets of MediaTek.
The latest MediaTek Dimensity 8100 and Dimensity 8000 chipsets feature four Cortex-A78 performance cores and four Cortex-A55 efficiency cores and the same also features a Mali G610 MC6 GPU. The latest MediaTek Dimensity 8100 mobile processor features 2.85GHz speeds and offers up to 2.75GHz. Both chips are built on TSMC’s 5nm process.
This supports MediaTek’s HyperEngine 5.0 technology and both features LPDDR5 RAM as well as UFS 3.1 storage. It is also featuring the MiraVision 780 display engine and up to 168Hz refresh rate as well as full-HD+ resolution, while the MediaTek Dimensity 8100 SoC will also support 120Hz refresh rate at WQHD+ resolution and the Dimensity 8000 chipsets feature a five gigapixel-per-second ISP and latest MediaTek Dimensity 8100 and Dimensity 8000 chipsets feature Imagiq 780 ISP with support for 200-megapixel cameras and HDR10+ video recording support at 4K resolution at 60fps.
The chipsets are also supporting 5G connectivity with an R16-ready 5G modem and the UltraSave 2.0 power saving feature. The newly announced MediaTek chipsets are supporting Wi-Fi 6E and Bluetooth 5.3 connectivity as well.
MediaTek also announced the Dimensity 1200 mobile processor and same features a high-performance ARM Cortex-A78 core clocked at 3GHz.
The newly announced chipsets will power the smartphones before the end of the first quarter of this year. So let’s wait for the new smartphones with the latest MediaTek chipsets in the coming days and we recommend you to stay tuned with us for the latest updates from the technological world at your fingertips.
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