Qualcomm has announced the launch of a new set of System On Chips aimed at providing better quality audio from true wireless earphones. The new and improved technology can be expected to feature in TWS earphones coming in the next couple of months.
The American giant launched the QCC514X and QCC304X series of chipsets, along with new audio technologies for upcoming TWS earphones. The QCC514X will power the premium range, and QCC304X will power mid-range true wireless earphones.
The new SoCs will replace QCC5100 and QCC30XX which powers current TWS earphones available in the market. These new SoCs will pack features like TrueWireless Mirroring and Hybrid Active Noise cancellation. These features will be present at a hardware level in the upcoming products.
TrueWireless Mirroring will let the primary connection with the source device switch seamlessly between either of the two earphones. This makes it easy for the user to play audio from either of the buds alone without glitches, and will intelligently select the bud with a more reliable connection as the primary headset.
Almost all of the true wireless earphone available today has a fixed ‘master earphone’ that receive audio from the device. But one exception is the Apple AirPods Pro that uses proprietary technology to overcome this flaw.
The Hybrid Active Noise Cancellation technology from Qualcomm will ensure a better listening experience and at the same time help the user be aware of the surrounding sounds. The always-on voice assistant activation allows the voice assistants to be triggered by voice without pressing any buttons.
Qualcomm claims that with the new technology a user can enjoy audio on the earphones continuously without putting the buds back into the charging case. This could lead to the charging cases shrinking in size and becoming more pocket friendly.
The new chipsets from Qualcomm will also support existing technologies such as cVc environmental noise cancellation and Qualcomm’s aptX Bluetooth codecs.