It is already confirmed that the upcoming Red Magic 10 Pro series will be announced in China on November 13 with cutting edge specifications. The company is adding fuel to the fire of excitement by sharing a new teaser and the same reveals the cooling details of the upcoming smartphone series.
The company says that the upcoming smartphone series will be coming with a cooling and display technology which will be the first in the industry and the company will be offering liquid metal as well as PC-level cooling technology to provide efficient heat management solution.
One of the top most executives of the company has confirmed that the upcoming Red Magic 10 Pro series will be coming with “ICE X Magic Cooling System” and the same leverages liquid metal. It will be capable to reduce core temperatures by up to 21 degrees.
The new cooling system of the upcoming smartphone series uses an innovative “sandwich structure” of low-temperature alloys layered around an indium base. So when the temperature of your device rises, these alloys partially melt and bind to the indium that will be enhancing thermal conductivity while maintaining stability and user safety.
It is also confirmed that the company will be launching the upcoming devices with a new generation of true full-screen displays and the 10 Pro will feature a 6.85-inch display with a 95.3% screen-to-body ratio. The upcoming smartphone series will come with the power of the Snapdragon 8 Elite mobile processor as well.
So let’s wait for the official announcement of the smartphone series and you guys are recommended to stick with us for more updates from the world of technology.
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