The popular chipset maker MediaTek is gearing up to unveil its latest smartphone chipset dubbed the Dimensity 8300 mobile processor on November 21 and today the important specification details of the same appear online. So without making any further delay let’s get into the article to check out the details.
According to the latest information, the upcoming Dimensity 8300 mobile processor is built on TSMC’s 4nm manufacturing process and the core CPU configuration includes a single high-performance Cortex-A715 core clocked at 3.35GHz, three additional Cortex-A715 performance cores running at 3.32GHz, and four power-efficient Cortex-A510 cores operating at 2.2GHz. The source is also saying that the upcoming mobile processor will feature Mali-G615 MC6 GPU for the graphical task.
It is believed that the upcoming Redmi K70 smartphone will come with the power of the upcoming Dimensity 8300 mobile processor it is also reported that the Dimensity 8300’s performance is expected to surpass that of the Qualcomm Snapdragon 7+ Gen 2 SoC.
So let’s wait for the launching of the upcoming mobile processor and you guys are recommended to stick with us for more updates from the world of technology.
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