The popular mobile chipset maker MediaTek is currently working on the next generation MediaTek Dimensity 9500 and it could be announced in the third quarter of this year. Now the reliable tipster Digital Chat Station has reported the important specification details of the upcoming MediaTek Dimensity 9500. So let’s get into the article to check out the new piece of information.
It is reported that the next generation Dimensity 9500 will be built on TSMC’s advanced N3P process and the mobile processor will feature a completely new large-core CPU setup. The CPU setup will include one Travis core, three Alto cores, and four Gelas cores. Travis and Alto are said to be based on ARM’s latest Cortex-X9 series and the same will be supporting SME instruction sets.
The processor will be including 16MB of L3 cache and 10MB of SLC cache. Memory support extends to quad-channel LPDDR5x RAM with speeds up to 10,667Mbps, along with four-lane UFS 4.1 storage compatibility. The processor will also come with Immortalis-Drage for the graphical task. This will be improving ray tracing capabilities while lowering power consumption. The Dimensity 9500 will also feature the NPU 9.0 that will be offering AI processing power of up to 100TOPS.
So let’s wait for more details about the upcoming Dimensity 9500 mobile processor and you guys are recommended to stick with us for more updates at your fingertips.
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