Qualcomm announced S3 and S5 voice platforms at the Mobile World Congress. The launch of these new sound platforms marks the expansion of the Snapdragon Sound Solution announced last year.
The new audio platforms from Qualcomm combine traditional Bluetooth with the latest low-energy (LE) audio technology standards. It aims to significantly improve the audio quality when listening to music with wireless earbuds, headphones and mobile devices.
Bluetooth LE enables audio capabilities to be transmitted to unlimited devices and to share audio streams in a secure environment. The newly announced audio chips are used on Qualcomm Snapdragon 8 mobile platforms, FastConnect 6900 and the new 7800 subsystem to “provide the ultimate wireless sound experience”.
The company offers 16-bit 44.1kHz lossless Bluetooth audio experience and 32kHz super wideband voice call quality. Qualcomm claims that the 68ms ultra low latency gaming mode is 25% cheaper than the previous generation. It also incorporates Adaptive Active Noise Cancellation into a dedicated hardware block.
Qualcomm says customers will begin sampling commercial versions of the S5 Sound Platform (QCC517x) and S3 Sound Platforms (QCC307x) in the second half of 2022. Jabra, Xiaomi and iQOO were the first companies to use these audio platforms in their products.
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