The popular chipset maker Qualcomm is reportedly working on the next generation Snapdragon 8 Elite Gen 6 series to power the upcoming flagship smartphone models. The company will be launching the processor Series by the end of this year and it is also said to include two models including the vanilla variant and the Pro variant. So let’s get into the article to check out the details.
According to the latest information from the Chinese source, in the popular chipset maker Qualcomm is expected to adopt Heat Pass Block (HPB) technology, and it is worth mentioning that the same cooling method is believed to be used in Samsung’s Exynos 2600. It is worth mentioning that the HPB places a dedicated heat-spreading layer directly on top of the chipset package.
So this method is considered to provide better heat management. We need to wait for more details in the coming months and you guys are recommended to stick with us for more updates at your fingertips.
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